MWC6000
MWC6000
We have started selling the MWC6000, an optimal implementation device for Wafer Level Package (WLP). The MWC6000 enables high-precision implementation on 300mm size wafers, with a stage that achieves flatness of less than 1um using a granite base and air flotation. It also features linear motor drive on both the X and Y axes for high-speed processing. The X-axis is driven by dual motors on both sides. To ensure precision, high-precision glass scales (manufactured by Heidenhain) are installed on all axes, and it is controlled in a full closed-loop system. Additionally, vibrations that can affect precision are canceled using a servo algorithm, reducing them to 1/40 of conventional levels. This eliminates constraints on the installation location of the device, allowing for more flexible layouts. Furthermore, this functionality increases operational speed, reducing the movement time to each position to 150ms, which is half of the conventional time. The positioning accuracy is also 400nm, achieving both high precision and high speed. Applications for this device include high-precision component implementation at the wafer level, manufacturing optical components at the wafer level, and high-precision implementation applications for stages used in inspection, cutting, and MEMS on wafers.
- 企業：AJI
- 価格：Other
